IESS Call for Papers

International Embedded Systems Symposium 2007 - Call for Papers

Just before the Int. Conference on Microelectronic Systems Education (MSE) in San Diego, June 3-4 2007
and the Design Automation Conference (DAC) in San Diego, June 4-8 2007.

Conference Theme:

Over recent years, embedded systems have gained an enormous amount of processing power and functionality. Many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations.
Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simultaneously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price. The significance of these constraints varies depending on the application area a system is targeted for. Typical embedded applications include multi-media, automotive, medical, and communication devices.

The goals of the International Embedded Systems Symposium are to present exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of embedded systems. Contributors and participants from both industry and academia are encouraged to take active part in this symposium.

Topics: Topics include, but are not restricted to the following:

Specification and modeling of embedded systems
Design methodology for embedded systems
Validation and verification of embedded systems
New technologies and trends for embedded systems
Hardware/software co-design
Re-configurable architectures and applications
Software synthesis for embedded systems
Distributed and modular controller architectures
Network and communication systems
Dependability and fault tolerance
Power management and optimization
Medical applications
Case studies of actual embedded systems

Important Dates:

~~December 20, 2006~~ January 5, 2007	Submissions due
~~January 20, 2006~~ February 14, 2007	Notification of acceptance
~~February 20, 2007~~ February 28, 2007	Final papers

Important Dates for Tutorial Submission:

A tutorial submission should consist of a title and an abstract (0,5 to 1 page) including names and affiliation.
Please send your tutorial proposal to: achim@c-lab.de

~~December 15, 2006~~ December 30, 2006	Submissions due
~~December 20, 2006~~ January 5, 2007	Notification of acceptance

Final Paper Submission:

The Proceedings will be published by Springer SBM, the official publisher of IFIP. Full details on how to format your paper can be found at the web site of the conference publisher, Springer SBM. Accepted full papers have a page limit of 14 pages, short and case study papers of 10 pages. Again, please make sure to use the right paper style. Please submit all source files (LaTeX or Word only) of your paper including a PDF or PS file into one zip-archive.
Download the Copyright form and fax to Achim Rettberg, Fax: +49 (5251) 606066.

Please submit your final paper sources to:

IESS paper submission system
or in case of problems with the submission system by e-mail: iess@iess.org

Organizing Committee:

General Chairs	Achim Rettberg University Paderborn Fuerstenallee 11 D-33094 Paderborn Germany Phone: +49 (5251) 60-6110 Fax: +49 (5251) 60-6066 Email: achim@c-lab.de	Mauro C. Zanella ZF Lemförder GmbH Postfach 12 20 D-49441 Lemförde Germany Phone: +49 (5474) 60-4655 Fax: +49 (5474) 90-4855 Email: mauro.zanella@zf.com
General Co-Chair	Franz J. Rammig University Paderborn Fuerstenallee 11 D-33094 Paderborn Germany Phone: +49 (5251) 60-6500 Fax: +49 (5251) 60-6502 Email: franz@upb.de
Program Chair	Rainer Doemer University of California, Irvine 444C Engineering Tower Irvine, CA 92697-2625 USA Phone: +1 (949) 824-9007 Fax: +1 (949) 824-3203 Email: doemer@uci.edu
Local Arrangements Chair	Andreas Gerstlauer University of California, Irvine 5251 California Ave. Irvine, CA 92697-2625 USA Phone: +1 (949) 824-4922 Fax: +1 (949) 824-4789 Email: gerstlauer@cecs.uci.edu

Program Committee:

Richard Anthony – The University of Greenwich, England
Samar Abdi – University of California at Irvine, USA
Jürgen Becker – University Karlsruhe, Germany
Brandon Blodget – Xilinx Research Labs, USA
Christophe Bobda – University Kaiserslautern, Germany
Rainer Doemer – University of California at Irvine, USA
Cecilia Ekelin – Volvo Technology Corporation, Sweden
Rolf Ernst – Technical University Braunschweig, Germany
Masahiro Fujita – University of Tokyo, Japan
Andreas Gerstlauer – University of California at Irvine, USA
Frank Hansen – Altera, Germany
Joerg Henkel – University Karlsruhe, Germany
Thomas Heurung – Mentor Graphics, Germany
Uwe Honekamp – Vector Informatik, Germany
Marcel Jackowski – USP, Brazil
Kane Kim – University of California at Irvine, USA
Bernd Kleinjohann – C-LAB, Germany
Thorsten Koelzow – Audi Electronics Venture, Germany
Hermann Kopetz – Technical University Vienna, Austria
Horst Krimmel – ZF Friedrichshafen, Germany
Jean-Claude Laprie – LAAS, France
Thomas Lehmann – Philips, Germany
Roger May – Altera, England
Mike Olivarez – Freescale Semiconductor, USA
Frank Oppenheimer – OFFIS, Germany
Carlos Pereira – UFRGS, Brazil
Franz Rammig – University Paderborn, Germany
Achim Rettberg – C-LAB, Germany
Carsten Rust – Sagem Orga, Germany
Stefan Schimpf – Robert Bosch Ltda., Brazil
Juergen Schirmer – Robert Bosch GmbH, Stuttgart, Germany
Aviral Shrivastava – Arizona State University, USA
Joachim Stroop – dSPACE, Germany
Hiroyuki Tomiyama – Nagoya University, Japan
Ansgar Traechtler – University Paderborn, Germany
Flavio R. Wagner – UFRGS, Brazil
Mauro Zanella – ZF Lemförder, Germany
Jianwen Zhu – University of Toronto, Canada

Registration:

For registration information click here.

Location and Travel Information:

The conference will be held in Irvine, CA (USA) at the Beckmann Center, May 29 - June 1 2007.

For detailed travel information click here.

Check if you need a VISA for USA. If you need an invitation letter for your VISA please contact us.

Sponsoring:

IFIP WG 10.5 - SIG-ES	ZF Lemförder Fahrwerktechnik GmbH & Co. KG	University of Paderborn
Center for Embedded Compter Systems	Interested in sponsoring this event? Please contact: sponsoring@iess.org	University of California, Irvine
EBV Elektronik GmbH & Co. KG	Altera Corporation	Interested in IESS? Please contact: sponsoring@iess.org